Donfoam 825PIR HFC-365mfc base blend polyols bakeng sa foam e tsoelang pele ea PIR block
Donfoam 825PIR HFC-365mfc base blend polyols bakeng sa foam e tsoelang pele ea PIR block
LIEKETSENG
Donfoam825 e kopanya polyether polyol e sebelisitsoeng ha ho etsoa foam e nang le lelakabe le phahameng la PIR block e nang le HFC-365mfc/227 e le sesebelisoa sa foaming, lihlahisoa le karabelo ea isocyanate ka ho etsoa ha foam e na le sele e ts'oanang ea foam, conductivity e tlase ea mocheso, ts'ebetso ea ho kenya mocheso e ntle, tshebetso e thibelang malakabe e ntle, mocheso o tlase ha o na ho fokotseha ho fokolang joalo-joalo E sebelisoa haholo ts'ebetsong ea mefuta eohle ea mosebetsi oa ho kenya letsoho joalo ka: ho haha lerako la ka ntle, polokelo e batang, litanka, liphaephe tse kholo joalo-joalo.
LETLOTLO MONAKA
| Ponahalo | Seedi se bonaletsang se serolwana ho isa ho sootho |
| Viscosity e matla (25℃) mPa.S | 300±100 |
| Boima ba 'mele (20℃) g/ml | 1.20±0.1 |
| Mocheso oa polokelo ke ℃ | 10-25 |
| Khoeli ea botsitso ba polokelo | 6 |
RETS'ELISITSOE LEBAKA
| Lisebelisoa tse so fetoloe | pbw |
| DK-1101 Blend Polyether Polyol | 100 |
| Isocyanate | 180±20 |
THEKNOLOJI LE TS'EBETSO(theko e nepahetseng e fapana ho latela maemo a ts'ebetso)
| Lintho | Ho kopanya ka letsoho | Mochini oa khatello e phahameng |
| Mocheso oa thepa e tala ℃ | 20-25 | 20-25 |
| Mocheso oa hlobo ℃ | 50-60 | 50-60 |
| Nako ea Cream s | 25-35 | 20-30 |
| Gel nako s | 90.-130 | 70-100 |
| Tack nako ea mahala s | 150-200 | 120-160 |
| Boima ba mahala kg/m3 | 28-30 | 27-29 |
LITŠOANTŠISO TSA LEBULU LA MACHINE
| Kakaretso ea Mold density | GB 6343 | ≥45kg/m3 |
| Molding Core Density | ≥40kg/m3 | |
| Sekhahla sa lisele tse koetsoeng | GB 10799 | ≥90% |
| Thermal Conductivity ea pele (15℃) | GB 3399 | ≤24mW/(mK) |
| Matla a Khatellang | GB/T8813 | ≥150kPa |
| Dimentional Stability 24h -20℃ 24h70℃ | GB/T8811 | ≤1% ≤1.5% |
| Sekhahla sa ho Monyeha ha Metsi | GB 8810 | ≤3% |
| Ho chesa | GB 8624 | B1/B2/B3 |
| Sekhahla sa lisele tse koetsoeng | GB 10799 | ≥90% |
| Thermal Conductivity ea pele (15℃) | GB 3399 | ≤24mW/(mK) |
Lintlha tse fanoeng ka holimo ke boleng bo tloaelehileng, bo lekoang ke k'hamphani ea rona.Bakeng sa lihlahisoa tsa k'hamphani ea rona, data e kenyellelitsoeng molaong ha e na lithibelo.
Lihlopha tsa lihlahisoa
-
Donpipe 301 metsi botlaaseng motsoako polyols bakeng sa pipeli...
-
Doncool 103 CP/IP motheo oa motsoako oa polyols
-
Inov Blend Foam Polyether Polyol bakeng sa Sehatsetsi...
-
Donpanel 415PIR HFC-365mfc botlaaseng motsoako polyols f...
-
Doncool 105 HFC-365mfc botlaaseng motsoako polyols
-
Donfoam 813 CP/IP motheo oa motsoako oa polyols bakeng sa thibela ...