Donfoam 823PIR CP/IP base blend polyols bakeng sa foam e sa khaotseng ea PIR block
Donfoam 824PIR HFC-245fa base blend polyols bakeng sa foam e tsoelang pele ea PIR block
LIEKETSENG
Donfoam823 e kopanya polyether polyol e sebelisa CP kapa CP/IP e le sesebelisoa sa ho foka, e sebelisoang ho hlahisa foam e nang le lelakabe le phahameng la PIR block, e nang le ts'ebetso ea sele e ts'oanang ea foam, conductivity e tlase ea mocheso, insulation e ntle ea mocheso le lelakabe le phahameng, mocheso o tlase ha o na ho putlama ho hoholo. joalo-joalo E sebelisoa haholo ts'ebetsong ea mefuta eohle ea mosebetsi oa ho kenya letsoho joalo ka: ho haha lerako la ka ntle, polokelo e batang, litanka, liphaephe tse kholo joalo-joalo.
LETLOTLO MONAKA
Ponahalo Viscosity e matla (25℃) mPa.S Boima ba 'mele (20℃) g/ml Mocheso oa polokelo ke ℃ Khoeli ea botsitso ba polokelo | Seedi se bonaletsang se serolwana ho isa ho sootho 500±100 1.20±0.1 10-25 6 |
RETS'ELISITSOE LEBAKA
Lintho | PBW |
DK-1103 Blend Polyether Polyol CP kapa CP/IP Isocyanate | 100 11-13 165-175 |
THEKNOLOJI LE TS'EBETSO(theko e nepahetseng e fapana ho latela maemo a ts'ebetso)
Ho Kopanya ka Matsoho | |
Raw Material Mocheso ℃ Mould Mocheso ℃ CT s GT s TFT s Mahala Density kg/m3 | 20-25 Thempereichara e Ambient (15-45℃) 35-60 140-200 240-360 28-35 |
LITŠOANTŠISO TSA LEFULU
Ntho | Tekanyetso ea Teko | Tlhaloso |
Kakaretso Molding Density Molding Core Density | ASTM D1622 | ≥50kg/m3 ≥40kg/m |
Sekhahla sa lisele tse koetsoeng | ASTM D2856 | ≥90% |
Thermal Conductivity ea pele (15℃) | ASTM C518 | ≤24mW/(mK) |
Matla a Khatellang | ASTM D1621 | ≥150kPa |
Botsitso ba Dimensional 24h -20 ℃ RH90 70℃ | ASTM D2126 | ≤1% ≤1.5% |
Sekhahla sa ho Monyeha ha Metsi | ASTM D2842 | ≤3% |
Ho chesa | ASTM D1692 | Boiketsi ba ho tima |