PriceList for Adhesive Series - Semi-rigid Foam System – INOV
PriceList for Adhesive Series - Semi-rigid Foam System – INOV Detail:
Semi-rigid Foam System
APPLICATIONS
It has high productivity, low power, which widely applies to autocar, autobicycle, train, airplane, furniture etc., which applies to instrument board, sun shield , bumper padding, packing material etc.
CHARACTERISTICS
DYB-A (Part A) adopts cold cure technology, it consists of hyperactivity polyether polyol and POP, crossing linking agent, chain extendor, stabilizing agent, foaming agent, and compound catalyst etc. It reacts with isocyanate DYB-B(Part B), adopting cold curing technology to make cold curing polyurethane foam, which has high compress load value, dimension stability, light weight, durable etc. There are many grades containing mix MDI grade, modified MDI grade, low pulverization and environmental protection grade, flame retardant etc.
SPECIFICATION
Item |
DYB-A/B |
Ratio(Polyol/Iso) |
100/45-100/55 |
Mould Temperature ℃ |
40-45 |
Demolding Time min |
30-40 |
Core Density kg/m3 |
120-150 |
AUTOMATIC CONTROL
The production is controlled by DCS systems, and packing by automatic filling machine.
RAW MATERIAL SUPPLIERS
Basf, Covestro, Wanhua…
Product detail pictures:

Related Product Guide:
We can always satisfy our respected customers with our good quality, good price and good service due to we are more professional and more hard-working and do it in cost-effective way for PriceList for Adhesive Series - Semi-rigid Foam System – INOV , The product will supply to all over the world, such as: Algeria, Nepal, US, Our company follows laws and international practice. We promise to be responsible for friends, customers and all partners. We would like to establish a long-term relationship and friendship with every customer from all over the world on the basis of mutual benefits. We warmly welcome all old and new customers to visit our company to negotiate business.

The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
